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| Established in 1983, Fong Yong is a professional manufacturer of resins, who has devoted to the R&D of Resins for a long time. We regard our customers as treasures,and set our business objective as to offer the best quality of products and service to our customers, in order to satisfy all of the requirements of our customers. We get abundant experience on the manufacture of epoxy, silicones, acrylic and polyurethane . Our products encompass excellent weather resistance, good Chemicall stability, sate and user friendly. We also committed to develop product with better adhesion properties, higher mechanical strength, and better dielectric properties.As requested, we also offer customized products with specific colors to satisfy customer's needs. Our R&D Dept. not only concentrates on the development of new products, but also plays the main role of solving the specific needs of our customers as well. We are proud of our achievements that we have solved numerous of particular problems for our customers and got satisfied responses from them. Our experienced R&D team is ready to take any challenge to provide our best technical knowledge for customized product sand to satisfy customers' most stringent needs. We have a wide range of products which could not be listed thoroughly on this catalog.If the products you need do not be recorded here, or you are not satisfied with the products you are using, you have any problem on adhesion, sealant, coating and insulating etc , please do not hesitate to contact us. We would be more than happy to answer all your inquiries, and to respond your specific project requests.
| | Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │ | | | | | | | | | - |
Doming resins│doming chemical│Clear doming resins │Epoxy doming resins│ │Polyurethane doming resins│ PU doming resins│ Domed coating │
FONG YONG Chemical Co., Ltd.
2F. No 216-2, Chung Chang Rd, Su-Lin, Taipei Hsien, Taiwan, R.O.C. TEL : 886-2-2682-4939 FAX : 886-2-2683-4333 E-Mail : fongyong@fongyong.com.tw | | |
| | │Potting compounds│epoxy potting compounds│Silicone potting compounds│Electronic potting and encapsulating compounds│Electrical and encapsulant potting compounds│ | Tags: clear doming resin, doming resin, electrical and encapsulant potting compo, electronic potting and encapsulating com, encapsulating compound, epoxy, epoxy potting compounds, polyurethane, potting, potting and encapsulating compound, potting compounds, silicone potting compounds, thermal compound
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Features of Epoxy Resins 1. Excellent insulation It can resist least 15 KV even at 1 mm thickness. 2. Good adhesion properties Good adhesion properties to most materials. 3. Good acidic and basic resistance Cured products exhibit good resistance in high level of acid and base solvents. 4. Good protection of design secrete Cured products perform high-durometer, not easy to be destroyed. 5. Reach UL levels Most products are UL approved. Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │
Applications of Epoxy Resins 1. Adhering and sealing. 2. Potting and molding. 3. Laminating.
One-Component Epoxy Resins
| P/N | Color | CPS | Features | Applications | | E-1200 | Black paste | 4,000 | good fluidity, low temperature curable | for small area potting of electric products | | E-1202 | Black paste | 60,000 | low temperature curable, good adhesion properties | for adhesive and sealing of electric parts | | E-1210 | Black paste | 35,000 | good heat impact resistance | for pottery clay material adhesive potting | | E-1214 | Black paste | 60,000 | good adhesive | IC sealing | | E-1215 | Fluorescent red | 600,000 | fast cure, short term high temperature resistance (280 oC) | SMT adhesive | | E-1304 | White paste | 25,000 | screen printable, good adhesive to glass | LCD sealing | | E-1385B | Red thixtropic | 150,000 | fast cure short term high temperature resistance (280 oC) | SMT adhesive, screen printing | | E-1525 | Black paste | 120,000 | non-sag, good heat resistance (180 oC) | electronic devices adhesive |
Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │ Two-Component Epoxy Resins
P/N | Color | Mixing ratio | CPS | Features and Applications | E-0001/H-0001 | Clear | 3:1 | 1900/80 | low viscosity, high transparency, for metal surface encapsulating | E-110/H-101 | Clear | 3:1 | 11000/100 | imitated enamel, low viscosity, good for winter use | E-120B/H-100 | Black | 3:1 | ? | high elongation strength, impact resistance, good adhesion to metals and plastics | E-126/H-2 | Clear | 2:1 | ? | low viscosity, good adhesion to metals and plastics | E-190/H-190 | Clear | 100:40 | 2000/110 | good electrical properties, low reactive energy, suitable for large electronic parts potting | E-226/H-226 | Light yellowish brown | 2:1 | - /4000 | long pot life, non-sag, good adhesion properties | E-226/H-816 | Light yellowish brown | 3:1 | - /7000 | fast-curing, good adhesion properties | E-532A/H-532B | Black | 100:15 | 3300/60 | UL94V0 approved, potting | E-536A/H-536B | Black | 100:30 | 6000/180 | UL94V0 approved, high voltage resistant, high temperature resistant up to 170 oC | E-638/H-638 | Black | 100:30 | 45000/180 | high voltage resistance, high thermal conductivity, suitable for high volt ignition for motor-vehicles | E-721/H-721 | Clear | 1:1 | 1500/150 | good softness, for very tenuous lines potting and protection | E-759/H-759 | Black | 100:30 | 6000/150 | UL94V0 approved, soft potting, suitable for protection of tenuous lines | E-768/H-768 | Clear | 2:1 | 1000/500 | cold-resistance, good flexible, suitable for electronic parts potting | E-5600/H-5600 | Variable colors | 2:1 | 4000/300 | Easy handle, electronic & electrical components potting |
Doming resins │doming chemical│Clear doming resins │Epoxy doming resins│ │Polyurethane doming resins│ PU doming resins│ Domed coating │
| | | | | | | | | | Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │ |
| Tags: clear doming resin, doming resin, electrical and encapsulant potting compo, electronic potting and encapsulating com, encapsulating compound, epoxy, epoxy potting compounds, polyurethane, potting, potting and encapsulating compound, potting compounds, silicone potting compounds, thermal compound
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